X-eye 6300

In-Line 3DCT AXI



  • High speed 3D In Line Inspection System (~4.3 sec/FOV)

  • Best Solution for both-side layered PCB

  • Various defects detectable – BGA, Chip component and etc.

High-speed In-Line 3D CT Inspection System
Automatically inspects the defects of products in customer’s line with high-speed 3D CT tomography.
Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.
Inspection speed of 4 sec/FOV from loading to automatic Good/NG judgement.



X-ray Tube 160 kV / 500 µA
Min. Resolution 0.8 ~ 15 µm
Table Size Min : 50 x 50 (mm), Max : 330 x 250 (mm)
Detector 12 inch FPXD
CT Scan Method Oblique CT
Objects BGA, Through Hole, BGA, Chip, QFN, QFP
Defects BGA Short, Bridging, Open, De-wet, Void, etc
Foot print 1,360 x 1,880 x 1,700 mm Control Box : 640 x 950 x 1,190 mm
Weight 4,200kg

BGA Void / 3D Inspection

Through Hole Filling / 3D Inspection