In-Line 2D AXI / WAXI
High speed 2D In Line inspection System (0.5 sec/FOV)
Various defect inspection – BGA, Chip, QFN, QFP etc
WAXI : Wire Automatic X-ray Inspection Detection of wire defects possible (Shorts, sweep, mssing, etc)
|In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.
Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
|X-ray Tube||160 kV / 500 µA (option 130 KV / 300 µA)|
|Min. Resolution||0.8 ~ 15 µm|
|Table Size||Min : 50 x 50 (mm), Max : 330 x 250 (mm)|
|Detector||1.6 M Pixel FPD|
|Objects||BGA, Chip, QFN, QFP, Wire Bonding|
BGA : Short, Bridging, Void
Chip : Manhattan, Miss align, Short
Wire Bonding : Sweep, Broken, Double Bonding, Missing
|Dimension||1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg|