X-eye 6200
In-Line 2D AXI / WAXI
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High speed 2D In Line inspection System (0.5 sec/FOV)
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Various defect inspection – BGA, Chip, QFN, QFP etc
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WAXI : Wire Automatic X-ray Inspection Detection of wire defects possible (Shorts, sweep, mssing, etc)
| In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-ray inspection in various production site, integrated with other manufacturing equipements. |
Specifications
| X-ray Tube | 160 kV / 500 µA (option 130 KV / 300 µA) |
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| Min. Resolution | 0.8 ~ 15 µm |
| Table Size | Min : 50 x 50 (mm), Max : 330 x 250 (mm) |
| Detector | 1.6 M Pixel FPD |
| Objects | BGA, Chip, QFN, QFP, Wire Bonding |
| Defects |
BGA : Short, Bridging, Void Chip : Manhattan, Miss align, Short Wire Bonding : Sweep, Broken, Double Bonding, Missing |
| Dimension | 1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg |
SMT Chip BGA / 2D Inspection
Wire Bonding / 2D Inspection
Applications
